Advanced Microscopy

A suite of state-of-the-art electron, ion, and x-ray microscopy provides high spatial resolution imaging and compositional analysis, in 2D and 3D (destructively or non-destructively).

Transmission Electron Microscope

As one of the first operators in Western Canada, nanoFAB provides training and access to JEOL JEM-ARM200CF Transmission Electron Microscope

200, 80, and 60 kV acceleration voltage
<0.1 nm resolution (HAADF STEM)
Large-angle SDD-EDX detector
In-situ heating and electrochemical holders

A close up of an intel chip revealing its lithography features.

Focused Ion Beam (FIB)

ThermoFisher Helios Hydra Plasma FIB/SEM dual-beam system, equipped with multiple ion species, micromanipulator, gas injection system and fast EDX detector, is widely utilized for ion-beam patterning, micro-sample manipulation/preparation and 3D characterization

Multiple Ion species: Xe, Ar, O and N
Ultra high resolution FESEM: 0.6 nm
Analytical detectors: STEM, BSD, EDX
Gas injection system (GIS): C, Pt and W
TEM sample preparation
FIB/SEM tomography
Transfer shuttle for air-sensitive materials
Direct ion beam patterning

(Field-Emission) Scanning Electron Microscope (SEM)

The nanoFAB houses 3 SEMs (2 FESEMs and 1 thermal emission SEM), supporting different levels of SEM analysis needs, including undergraduate and graduate courses, entry-level inspection, and advanced analytical characterization

Zeiss Sigma FESEM

Schottky field-emission source
Excellent low-voltage imaging
EDX and EBSD detectors

Hitachi S4800 FESEM

Cold field-emission source
STEM and EDX detectors

X-Ray Microscopy / nanoCT

Zeiss Xradia Versa 620 XRM provides high throughput, non-destructive, high resolution 3D/4D analysis of materials that are not limited to vacuum compatibility.

Non-destructive high resolution 3D X-Ray imaging: better than 500 nm
High power (25 W) X-Ray source with energy range of 30 – 160 kV
Integrated in-situ thermal/mechanical testing stage (Deben)