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Advanced Lithography

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Contact photolithography 

 

  • General-purpose UV exposures
  • H-line (405 nm) / I-line (365 nm)
  • IR/optical backside alignment
  • Deep-UV exposures (220 nm / 254 nm)
  • Semi-automated alignment
  • Positive/negative tone resist chemistries
A close up of an intel chip revealing its lithography features.

In-house photomask fabrication 

 

  • Produces 5" & 7" photomasks
  • 1 µm minimum feature size
  • Full-service processing with online mask submission
A close up of an intel chip revealing its lithography features.

Focused ion beam milling 

 

  • Zeiss ORION helium ion microscope with gallium FIB
  • He beam for milling delicate sub-10 nm nanostructures (nanomachining)
  • Ga FIB for bulk micromachining
  • Patterning and imaging controlled using Fibics NPVE system
A close up of an intel chip revealing its lithography features.